ArticleOpen Access http://dx.doi.org/10.26855/memt.2024.12.004
Research on Device Process Characteristics and Improving PCB Manufacturing Process Level
Jiekun Wu, Liande Wei, Jie Yu, Qiangbing Li, Qianwei Deng
Shenzhen Kunbiaolin Brothers Electronics Co., Ltd., Shenzhen 518103, Guangdong, China.
*Corresponding author: Jiekun Wu
Published: November 29,2024
Abstract
The research and development of printed circuit boards is inseparable from the rapid development of devices. Because the developed printed circuit boards must meet the electrical technical requirements of the devices, so that the functional parameters of the devices can play a fuller role, to ensure the high stability and high reliability of the operation time of electronic equipment. In particular, the progress of surface mount (SMT) and micro assembly (CSP or CMT) devices has put forward higher technical requirements for the manufacturing process of printed circuit boards. For this reason, the manufacturing process of printed circuit boards must adapt to the needs of the rapid development of microelectronics technology. Therefore, studying the process characteristics of devices is an important way to develop printed circuit boards with novel structures. Therefore, starting from the characteristics of device processes, this article mainly studies and explores how to improve the manufacturing process level of printed circuit boards.
Keywords
Device process; manufacturing level; PCB; improvement
References
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How to cite this paper
Research on Device Process Characteristics and Improving PCB Manufacturing Process Level
How to cite this paper: Jiekun Wu, Liande Wei, Jie Yu, Qiangbing Li, Qianwei Deng. (2024). Research on Device Process Characteristics and Improving PCB Manufacturing Process Level. Mechanical Engineering and Manufacturing Technology, 1(1), 15-19.
DOI: http://dx.doi.org/10.26855/memt.2024.12.004